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IEEE/CAA Journal of Automatica Sinica被SCI,，EI，Scopus，DBLP等數據庫收錄，入選中國科技期刊卓越行動計劃世界一流重點建設期刊、中國科協自動化領域T1級高質量科技期刊、計算領域高質量科技期刊T1類（最頂級）、中國科技核心期刊、ESI刊源期刊，自首次參評以來已連續五年榮獲“中國最具國際影響力學術期刊”稱號（Top5%）。

IEEE/CAA Journal of Automatica Sinica是中科院期刊分區工程技術和計算機科學類一區Top期刊；2024年SCI影響因子19.2，在自動化與控制領域排名全球第1（前1%)，是該領域唯一的中國主辦Q1區SCI期刊；2024年CiteScore為28.2，在控制與優化領域排名全球第1，在計算機信息系統、控制與系統工程、人工智能領域分別排名前5%-7%，均位于Q1區前列，；全球TOP1000期刊榜單計算機與電子領域排名世界前12%、中國第1；谷歌學術計量自動化與控制理論學科頂級出版物中排名全球第7，是該學科TOP20出版物中世界最年輕且唯一中國主辦的期刊。

期刊主頁：http://www.ieee-jas.net

在線投稿：https://mc03.manuscriptcentral.com/ieee-jas

編委會：https://www.ieee-jas.net/news/Current.htm

聯系方式

電話：010-61943113

email：jas@caa.org.cn  

網址：https://www.ieee-jas.net  

主編   

Qing-Long Han   Swinburne University of Technology, Australia

副主編  

Derong Liu   Guangdong University of Technology, China    

Zhongping Jiang   New York University, USA    

Qinglai Wei    Chinese Academy of Sciences, China    

編委

Cesare Alippi   Politecnico di Milano, Italy

Panos J. Antsaklis   University of Notre Dame, USA

Tamer Basar   University of Illinois, USA

Dimitri P. Bertsekas   Massachusetts Institute of Technology, USA

Bijnan Bandyopadhyay  Indian Institute of Technology Bombay, India

Zhengcai Cao   Beijing University of Chemical Technology, China

Long Chen   University of Macau, Macau

C. L. Philip Chen   University of Macau, Macau

Mo-Yuen Chow  Shanghai Jiaotong University, China

L. Chen  Sun Yat-sen University, China

Weiping Ding   Nantong University, China

Daoyi Dong   University of New South Wales, Australia

Giuseppe Franzè   University of Calabria, Italy

Shangce Gao University of Toyama, Japan

Weinan Gao Florida Institute of Technology, USA

Fengling Han   Royal Melbourne Institute of Technology, Australia

Wei He   University of Science & Technology Beijing, China

Zengguang Hou   Chinese Academy of Sciences, China

Tingwen Huang  Texas A&M University at Qatar, Qatar

Biao Huang  University of Alberta, Canada

Frank L. Lewis   The University of Texas at Arlington, USA

Hongyi Li  Guangdong University of Technology, China

Shuai Li   Swansea University, UK

Chenglin Liu    Chinese Academy of Sciences, China

Honghai Liu  University of Portsmouth, UK

Lichuan Liu   Northern Illinois University, USA

Xiaoping Liu    Carleton University, Canada

Yan-Jun Liu    Liaoning University of Technology, China

Xin Luo    Chinese Academy of Sciences, China

Yan Lu   NIST, USA

Antonio Marcus Nogueira Lima  Universidade Federal de Campina Grande, Brazil

Xiaoxiang Na   University of Cambridge, UK

Thomas Parisini   University of Trieste, Italy

Marios M. Polycarpou    University of Cyprus, Cyprus

Xuemin Shen   University of Waterloo, Canada

Jinhua She  Tokyo University of Technology, Japan

Lei Shu    University of Lincoln, UK

Zhen Song   Siemens Corporation, USA

Fei-Yue Wang    Chinese Academy of Sciences, China

Jiacun Wang   Monmouth University, USA

Shouguang Wang  Zhejiang Gongshang University, China

Zidong Wang   Brunel University London, UK

Donald C. Wunsch II   Missouri University of Science and Technology, USA

Yang Xiang  Swinburne University of Technology, Australia

Peter Xiong   Microsoft, USA

Tao Yang  Northeastern University, China

Hui Yu  Pouthmoth University, UK

Huaguang Zhang  Northeastern University, China

Jun Zhang   Denver University, USA

Nian Zhang   University of the District of Columbia, USA

Jinyun Zhang   Mitsubishi Electric Research Laboratories, USA

Mengchu Zhou  New Jersey Institute of Technology, USA